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Gabatarwar Laser Processing a Manufacturing
Fasahar sarrafa Laser ta sami ci gaba cikin sauri kuma ana amfani da ita sosai a fagage daban-daban, kamar sararin samaniya, motoci, kayan lantarki, da ƙari.Yana taka muhimmiyar rawa wajen inganta ingancin samfur, yawan aiki, da aiki da kai, yayin da rage gurɓataccen gurɓataccen abu da amfani da kayan aiki (Gong, 2012).
Laser Processing a Karfe da Non Metal Materials
Aikace-aikacen farko na sarrafa Laser a cikin shekaru goma da suka gabata ya kasance a cikin kayan ƙarfe, gami da yankan, walda, da sutura.Koyaya, filin yana faɗaɗa zuwa kayan da ba ƙarfe ba kamar su yadi, gilashi, robobi, polymers, da yumbu.Kowane ɗayan waɗannan kayan yana buɗe damar a cikin masana'antu daban-daban, kodayake sun riga sun kafa dabarun sarrafawa (Yumoto et al., 2017).
Kalubale da sabbin abubuwa a cikin sarrafa Laser na Gilashin
Gilashi, tare da fa'idodin aikace-aikacen sa a cikin masana'antu kamar kera motoci, gini, da na'urorin lantarki, yana wakiltar wani yanki mai mahimmanci don sarrafa Laser.Hanyoyin yankan gilashin gargajiya, waɗanda suka haɗa da kayan aikin gami ko lu'u-lu'u, ana iyakance su ta ƙarancin inganci da ƙarancin gefuna.Sabanin haka, yankan Laser yana ba da mafi inganci kuma madaidaiciyar madadin.Wannan ya bayyana musamman a cikin masana'antu kamar masana'antar wayar hannu, inda ake amfani da yankan Laser don murfin ruwan tabarau na kyamara da manyan allon nuni (Ding et al., 2019).
Sarrafa Laser Nau'in Gilashin Masu Mahimmanci
Gilashin nau'ikan gilashi daban-daban, kamar gilashin gani, gilashin quartz, da gilashin sapphire, suna gabatar da ƙalubale na musamman saboda ƙarancin yanayinsu.Duk da haka, ci-gaba fasahar Laser kamar femtosecond Laser etching sun taimaka madaidaicin sarrafa waɗannan kayan (Sun & Flores, 2010).
Tasirin Wavelength akan Hanyoyin Fasaha na Laser
Tsawon tsayin laser yana tasiri sosai akan tsari, musamman ga kayan kamar ƙarfe na tsari.Lasers da ke fitowa a cikin ultraviolet, bayyane, kusa da wuraren infrared masu nisa an yi nazarinsu don tsananin ƙarfinsu don narkewa da ƙafewa (Lazov, Angelov, & Teirumnieks, 2019).
Aikace-aikace Daban-daban Dangane da Tsawon Wave
Zaɓin tsayin igiyoyin Laser ba na sabani ba ne amma yana dogara sosai akan kaddarorin kayan da sakamakon da ake so.Misali, Laser UV (tare da guntun raƙuman raƙuman ruwa) suna da kyau kwarai don zane-zane na musamman da micromachining, saboda suna iya samar da cikakkun bayanai.Wannan ya sa su dace don masana'antar semiconductor da microelectronics.Sabanin haka, infrared lasers sun fi dacewa don sarrafa kayan aiki mai kauri saboda zurfin shigar su, yana sa su dace da aikace-aikacen masana'antu masu nauyi.(Majumdar & Manna, 2013) Hakazalika, koren lasers, yawanci aiki a tsawon 532 nm, suna samun alkuki a cikin aikace-aikacen da ke buƙatar babban madaidaici tare da ƙaramin tasirin zafi.Suna da tasiri musamman a cikin microelectronics don ayyuka kamar ƙirar da'ira, a cikin aikace-aikacen likita don hanyoyin kamar photocoagulation, da kuma a cikin sassan makamashi mai sabuntawa don ƙirƙira ƙwayoyin rana.Green Laser' musamman tsayin raƙuman ruwa kuma ya sa su dace da yin alama da sassaƙa abubuwa daban-daban, gami da robobi da karafa, inda ake son babban bambanci da ƙarancin lalacewa.Wannan daidaitawar laser kore yana nuna mahimmancin zaɓi na tsawon tsayi a cikin fasahar laser, yana tabbatar da sakamako mafi kyau ga takamaiman kayan aiki da aikace-aikace.
The525nm kore Laserwani takamaiman nau'in fasahar Laser ne wanda ke da fitattun fitattun hasken korensa a tsawon nanometer 525.Green Laser a wannan tsawon tsawon suna samun aikace-aikace a cikin ƙwanƙwasawa na retinal, inda babban ƙarfin su da daidaito yana da fa'ida.Hakanan suna da yuwuwar amfani wajen sarrafa kayan, musamman a fagagen da ke buƙatar madaidaicin sarrafa tasirin zafi.Haɓaka diodes masu launin kore akan c-plane GaN substrate zuwa tsayin tsayin raƙuman ruwa a 524-532 nm yana nuna babban ci gaba a fasahar laser.Wannan ci gaban yana da mahimmanci ga aikace-aikacen da ke buƙatar takamaiman halaye na tsawon zango
Cigaban Wave da Tushen Laser Madaidaitan
Ci gaba da kalaman na ci gaba (CW) da kuma ƙirar ƙira-CW Laser tushe a tsayi daban-daban kamar kusa-infrared (NIR) a 1064 nm, kore a 532 nm, da ultraviolet (UV) a 355 nm ana ɗaukarsu don Laser doping zaɓin sel emitter hasken rana.Tsawon raƙuman ruwa daban-daban suna da tasiri don daidaitawar masana'anta da inganci (Patel et al., 2011).
Excimer Lasers don Faɗin Tazara Materials
Excimer Laser, aiki a wani tsawon UV, sun dace da sarrafa kayan bandgap mai fadi kamar gilashin da carbon fiber-reinforced polymer (CFRP), suna ba da madaidaicin daidaito da ƙaramin tasirin thermal (Kobayashi et al., 2017).
Nd:YAG Lasers don Aikace-aikacen Masana'antu
Nd: YAG Laser, tare da daidaitawarsu ta fuskar daidaita tsayin igiyoyin ruwa, ana amfani da su a cikin aikace-aikace da yawa.Iyawar su don aiki a duka 1064 nm da 532 nm suna ba da damar sassauci a sarrafa kayan daban-daban.Misali, 1064nm zangon ya dace don zane mai zurfi akan karafa, yayin da tsayin tsayin nm na 532nm yana ba da zane mai inganci mai inganci akan robobi da karafa masu rufi.(Moon et al., 1999).
→Kayayyaki masu alaƙa:CW Diode-pumped m-jihar Laser tare da 1064nm tsawo
High Power Fiber Laser Welding
Lasers tare da raƙuman raƙuman raƙuman ruwa kusa da 1000 nm, suna da ingancin katako mai kyau da ƙarfi, ana amfani da su a cikin waldawar laser keyhole don karafa.Wadannan lasers da nagarta sosai vaporize da narka kayan, samar da high quality welds (Salminen, Piili, & Purtonen, 2010).
Haɗewar sarrafa Laser tare da Wasu Fasaha
Haɗuwa da sarrafa Laser tare da sauran fasahohin masana'antu, irin su cladding da milling, ya haifar da ingantaccen tsarin samarwa da haɓaka.Wannan haɗin kai yana da fa'ida musamman a masana'antu kamar kayan aiki da ƙirar masana'anta da gyaran injin (Nowotny et al., 2010).
Sarrafa Laser a Filaye masu tasowa
Aikace-aikacen fasaha na Laser yana fadada zuwa filayen da ke tasowa kamar semiconductor, nuni, da masana'antar fina-finai na bakin ciki, suna ba da sabbin iya aiki da haɓaka kaddarorin kayan, daidaiton samfur, da aikin na'urar (Hwang et al., 2022).
Abubuwan da ke faruwa a gaba a cikin sarrafa Laser
Gaba gaba a Laser sarrafa fasahar mayar da hankali a kan novel ƙirƙira dabaru, inganta samfurin halaye, injiniya hadedde Multi-material aka gyara da kuma inganta tattalin arziki da kuma tsari fa'idodin.Wannan ya hada da Laser m masana'antu na Tsarin tare da sarrafawa porosity, matasan waldi, da Laser profile yankan karfe zanen gado (Kukreja et al., 2013).
Fasahar sarrafa Laser, tare da aikace-aikacenta iri-iri da ci gaba da sabbin abubuwa, suna tsara makomar masana'antu da sarrafa kayan aiki.Ƙarfinsa da daidaito sun sa ya zama kayan aiki mai mahimmanci a masana'antu daban-daban, yana tura iyakokin hanyoyin masana'antu na gargajiya.
Lazov, L., Angelov, N., & Teirumniek, E. (2019).HANYA DOMIN KIMANIN FARKO NA MAMAKIYAR WUTA A CIKIN HANYOYIN FASAHA KAN LASER.Muhalli.FASAHA.ASABAR.Abubuwan da aka gabatar na taron kasa da kasa na Kimiyya da Aiki. mahada
Patel, R., Wenham, S., Tjahjono, B., Hallam, B., Sugianto, A., & Bovatsek, J. (2011).Ƙirƙirar Babban Gudun Laser Doping Selective Emitter Solar Cells Amfani da 532nm Ci gaba da Wave (CW) da Maɓuɓɓugan Laser na Quasi-CW Modelocked.mahada
Kobayashi, M., Kakizaki, K., Oizumi, H., Mimura, T., Fujimoto, J., & Mizoguchi, H. (2017).DUV high ikon Laser aiki don gilashin da CFRP.mahada
Moon, H., Yi, J., Rhee, Y., Cha, B., Lee, J., & Kim, K.-S.(1999).Ingantacciyar mitar intracavity ninki biyu daga nau'in diode mai yaduwa-nau'in diode da aka buga Nd: YAG Laser ta amfani da crystal KTP.mahada
Salminen, A., Piili, H., & Purtonen, T. (2010).Halayen high iko fiber Laser waldi.Ayyukan Cibiyar Injiniyan Injiniya, Sashe na C: Jaridar Kimiyyar Injiniya, 224, 1019-1029.mahada
Majumdar, J., & Manna, I. (2013).Gabatarwa zuwa Laser Taimakon Kera Kayayyakin.mahada
Gong, S. (2012).Bincike da aikace-aikace na ci-gaba da fasahar sarrafa Laser.mahada
Yumoto, J., Torizuka, K., & Kuroda, R. (2017).Ƙirƙirar Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararren Ƙwararrun Ƙwararrun Ƙwararrun Ƙwararrun Laser-Material Processing.Binciken Injiniyan Laser, 45, 565-570.mahada
Ding, Y., Xue, Y., Pang, J., Yang, L.-j., & Hong, M. (2019).Ci gaba a cikin fasahar saka idanu a cikin wurin don sarrafa Laser.KIMIYYA SINICA Physica, Mechanica & Astronomica. mahada
Sun, H., & Flores, K. (2010).Binciken Ƙaƙƙarfan Ƙarƙashin Ƙarƙashin Gilashin Ƙarfe Mai Girma na Zr wanda aka sarrafa Laser.Karfe da Materials Ma'amala A. mahada
Nowotny, S., Muenster, R., Scharek, S., & Beyer, E. (2010).Haɗe-haɗe tantanin halitta na Laser cladding da niƙa.Automation Automation, 30(1), 36-38.mahada
Kukreja, LM, Kaul, R., Paul, C., Ganesh, P., & Rao, BT (2013).Dabarun Gudanar da Kayayyakin Laser masu tasowa don Aikace-aikacen Masana'antu na gaba.mahada
Hwang, E., Choi, J., & Hong, S. (2022).Sabbin matakan injin injin injin laser na taimakon laser don ingantacciyar madaidaici, masana'anta mai girma.Nanoscale. mahada
Lokacin aikawa: Janairu-18-2024